Chipworks Real Chips
Tuesday, November 30, 2010
IEDM Next Week!
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Next Sunday the great and the good of the electron device world will be gathering in San Francisco for the 2010 IEEE International Electron ...
Tuesday, November 2, 2010
TI Ships 40-µm Fine Pitch Copper Pillar Flip Chip Packages
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The week before Semicon West, Texas Instruments and Amkor released a joint announcement that they were shipping parts in fine pitch copper ...
Friday, October 8, 2010
Non-Intel HKMG Coming Soon? And 45LP Makes the Mainstream in Mobiles
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The last few weeks have seen some announcements that finally seem to show that HKMG (high-k, metal-gate) processes other than Intel are comi...
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Monday, September 13, 2010
Samsung’s Eight-Stack Flash Shows up in Apple’s iPhone 4
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Back in 2005 Samsung made an announcement that they would be shipping eight die stacked in the same package. At the time it seemed remarkab...
Thursday, July 22, 2010
Winbond Adopts Qimonda’s Buried Wordline Technology – Metal Gates Come to DRAMs
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Before Qimonda’s unfortunate demise last year, they delivered an impressive paper at IEDM 2008 [1] describing a “buried wordline” (BwL) DRAM...
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