Monday, January 31, 2011

Samsung’s 3x DDR3 SDRAM – 4F2 or 6F2? You Be the Judge..

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We recently acquired Samsung’s latest DDR3 SDRAM, allegedly a 3x-nm part. When we did a little research, we found that the package markings ...
5 comments:
Thursday, January 20, 2011

Common Platform Goes Gate-Last – at Last!

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At the IBM/GLOBALFOUNDRIES/Samsung Common Platform Technology Forum on Tuesday, Gary Patton of IBM announced that the Platform would be movi...
Tuesday, December 14, 2010

IEDM 2010 Retrospective – Part 1

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The International Electron Devices Meeting started its 56th session last week on Sunday in San Francisco. This year the program appears to m...
Tuesday, November 30, 2010

IEDM Next Week!

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Next Sunday the great and the good of the electron device world will be gathering in San Francisco for the 2010 IEEE International Electron ...
Tuesday, November 2, 2010

TI Ships 40-µm Fine Pitch Copper Pillar Flip Chip Packages

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The week before Semicon West, Texas Instruments and Amkor released a joint announcement that they were shipping parts in fine pitch copper ...
Friday, October 8, 2010

Non-Intel HKMG Coming Soon? And 45LP Makes the Mainstream in Mobiles

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The last few weeks have seen some announcements that finally seem to show that HKMG (high-k, metal-gate) processes other than Intel are comi...
2 comments:
Monday, September 13, 2010

Samsung’s Eight-Stack Flash Shows up in Apple’s iPhone 4

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Back in 2005 Samsung made an announcement that they would be shipping eight die stacked in the same package. At the time it seemed remarkab...